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學經歷： | |||||||||||||||
| 學歷： 台灣大學 化工博士 |
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| 專業技術 |
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| 電化學工程、半導體製程、腐蝕工程、光電元件製程、能源科技 | ||||||||||||||||
| 研發介紹 |
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| ◎ 期刊論文 | ||||||||||||||||
| "Metal Removal from Silicon Sawing Waste using the Electrokinetic Method",Journal of the Taiwan Institute of Chemical Engineers,1-5,2009/1/1(SCI) "Pretreatment of recycling wiresaw slurries—Iron removal using acid treatment and electrokinetic separation",Separation and Purification Technology,24-29,2009/6/1(SCI) "Acetic acid and phosphoric acid adding to improve tantalum chemical mechanical polishing in hydrogen peroxide-based slurry",Microelectronic Engineering,174-179,2010/2/1(SCI) "Effect of Organic Acids on Copper Chemical Mechanical Polishing",Microelectronic Engineering,2790-2798,2007/12/1(SCI) "Organic Acid Mixing to Improve ITO Film Etching in Flat Panel Display Manufacture",Journal of The Electrochemical Society,C86-C90,2006/1/1(SCI) "Wet etching mechanisms of ITO films in oxalic acid",Microelectronic Engineering,536-541,2006/3/1(SCI) "Effects of Nonionic Surfactants on Performance of Copper Chemical Mechanical Polishing",Chemical Engineering Communications,702-714,2006/6/1(SCI) "Glycolic Acid in Hydrogen Peroxide-Based Slurry for Enhancing Copper Chemical Mechanical Polishing",Microelectronic Engineering,193-203,2005/4/1(SCI) "A Study of Copper Chemical Mechanical Polishing in Urea-Hydrogen Peroxide Slurry by Electrochemical Impedance Spectroscopy",Applied Surface Science,120-135,2003/5/1(SCI) "Localized Corrosion Effects and Modifications of Acidic and Alkaline Slurries on Copper Chemical Mechanical Polishing",Applied Surface Science,190-205,2003/4/1(SCI) "電化學技術在半導體銅製程中的應用",化工技術,95-111,2007/4/1(ELSE1) "Adding Polyethylene Glycols to Enhance the Electrochemical Planarization of Copper-Plated Wafer",Northern Taiwan Journal,106-115,2006/11/1(ELSE1) "Effects of Added Surfactants on Chemical Mechanical Polishing in Nano-Alumina Slurries",Kung Wu Journal,93-103,2004/11/1(ELSE1) "Removal of metal impurities from cutting slurry waste using a modified electrokinetic system",Fresenius Environmental Bulletin,99-103,2011/1/1(SCI) "Copper electrodeposition in a through-silicon via evaluated by rotating disc electrode techniques",Journal of Micromechanics and Microengineering,115023,2010/11/1(SCI) "Electrochemical investigations for copper electrodeposition of through-silicon via",Microelectronic Engineering,195-199,2011/2/1(SCI) "Modified sedimentation system for improving separation of silicon and silicon carbide in recycling of sawing waste",Separation and Purification Technology,16-20,2011/3/1(SCI) "Iron Removal during Recovery of Silicon from Sawing Waste by Applying Magnetic Field",Separation Science and Technology,702 - 707,2011/1/1(SCI) "Silicon sawing waste treatment by electrophoresis and gravitational settling",Journal of Hazardous Materials,526-530,2011/5/1(SCI) "Recycling Silicon Wiresaw Slurries: Separation of Silicon and Silicon Carbide in a Ramp Settling Tank under an Applied Electrical Field",Journal of the Air & Waste Management Association,521-527,2013/2/1(SCI) "Recovery of indium from etching waste using a rotating cylinder electrode system",Fresenius Environmental Bulletin,1-6,2014/1/1(SCI) |
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| ◎ 研討會論文 | ||||||||||||||||
| "Iron Removal from Silicon Wiresaw Slurries",2008 Taiwan/Korea/Japan Chemical Engineering Conference and 55th Taiwan Institute of Chemical Engineers Annual Conference,Taipei,2008/11/22 "Electrochemical Planarization of Copper-Plated Wafer in Phosphoric Acid",The Electrochemical Society 211th Meeting,Chicago,2007/5/1 "The Chemical Mechanical Polishing of Ta Barrier and Its Electrochemical Characteristics",Chemical Engineering Annual Meeting,Miaoli,2005/11/22 "The Study on Planarizing Copper Thin Films by Electrochemical Polishing",Chemical Engineering Annual Meeting,Miaoli,2005/11/22 "Electrochemical Action between Cu and Ta/TaN Barrier during CMP",Chemical Engineering Annual Meeting,Tainan,2004/11/22 "Corrosion Action between Cu and Ta/TaN Barrier during CMP",The Electrochemical Society 206th Meeting,Hawaii,2004/10/3 "Effects of Added Various Surfactants on the Properties of Alumina Slurries",2003 Annual AICHE Meeting,San Francisco,2003/11/10 "Electropolishing of Indium Tin Oxide in Oxalic and Tartaric Acid",Active-Matrix Flatpanel Displays and Devices (AM-FPD 09),Nara,2009/7/1 "電場輔助矽切割廢料中矽與碳化矽之分離",第四屆資源工程研討會,台北,2009/9/10 "Solar-Grade Silicon Recovery from Wiresaw Waste Using an Electric Field",4th Asian Conference on Electrochemical Power Sources,Taipei,2009/11/8 "Electropolishing Mechanisms of Copper-Plated Wafer in Phosphoric Acid",Chemical Engineering Annual Meeting,Tao-Yuan,2007/11/22 "Electrochemical Impedance Spectroscopy of Copper during Electrochemical Polishing",Chemical Engineering Annual Meeting,Kaohsiung,2006/11/22 "Electrochemical Impedance Spectroscopy of Copper during Chemical Mechanical Polishing in Urea-H2O2 Slurries",Chemical Engineering Annual Meeting,Taipei,2003/11/22 "Electrochemical planarization of copper in phosphoric acid",The 7th Asian Conference on Electrochemistry (ACEC),Kumamoto,2010/5/18 "Electrochemical techniques for the study of high-aspect-ratio copper-electrodeposition",The 6th International Conference on MicroManufacturing (ICOMM),Tokyo,2011/3/7 "利用電化學技術將矽泥純化為太陽電池矽原料",99年中國材料科學學會年會,高雄,2010/11/19 "Recycling Silicon from Sawing Waste by Sedimentation in Applied Electrical and Magnetic Fields",IUMRS-ICA 2011 12th International Conference in Asia,Taipei,2012/1/19 "Separation of Metal Impurities from Silicon Sawing Waste",the 14th Asia Pacific Confederation of Chemical Engineering,Singapore,2012/2/21 "Metal removal from silicon cutting wastewater by microorganisms",2nd Water Research Conference,Singapore Expo,2013/1/20 "改良式沉降單元回收矽晶切割廢料中之矽和碳化矽",2012台灣化學工程學會59週年年會暨國科會化學工程學門成果發表會,台中,2012/11/23 "利用沉降程序回收矽泥廢料中的切割液",2013台灣化學工程學會60週年年會暨國科會化學工程學門成果發表會,台北,2013/11/22 "矽導通孔鍍銅液中抑制劑的開環劣化研究",2013台灣化學工程學會60週年年會暨國科會化學工程學門成果發表會,台北,2013/11/22 "利用不同多元醇製作直接甲醇燃料電池之鉑/碳陽極觸媒",2013台灣化學工程學會60週年年會暨國科會化學工程學門成果發表會,台北,2013/11/22 |
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| 專利介紹 |
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