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本發明為一種複合封裝材料，係由二氧化矽、三氧化二鋁、氧化釔及氧化鋅所組成，此複合封裝材料之玻璃轉化溫度介於694~833℃之間及膨脹係數介於7.0~8.5×10-6/℃之間。其中該二氧化矽與三氧化二鋁之莫耳數和占總莫耳數比例的41.88~62.22%，氧化釔之莫耳數占總莫耳數比例的10.48~26.67%以及氧化鋅之莫耳數占總莫耳數比例的11.11~47.64%。其中該三氧化二鋁之莫耳數和占總莫耳數比例的5.23~17.78%。其中該三氧化二鋁與該二氧化矽的比例為0.14~0.40，該氧化釔與該二氧化矽的比例為0.29~0.60，該氧化鋅與該二氧化矽的比例為0.25~1.30。
The present invention is a composite encapsulating material which consists of silicon dioxide, aluminum oxide, yttrium oxide and zinc oxide and has glass transition temperature between 694° C. and 833° C. as well as expansion coefficient between 7.0 and 8.5×10−6/° C. The ratio of the number of moles of silicon dioxide plus aluminum oxide (yttrium oxide or zinc oxide) to the total number of moles is 41.88˜62.22% (10.48˜26.67% or 11.11˜47.64%); the ratio of the number of moles of aluminum oxide to the total number of moles is 5.23˜17.78%. The ratios of aluminum oxide to silicon dioxide, yttrium oxide to silicon dioxide, and zinc oxide to silicon dioxide are 0.14˜0.40, 0.29˜0.60, and 0.25˜1.30, respectively.

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