可授權專利


(SMA連接器) 


專利名稱 垂直轉接結構
專利國家
   專利證書號
美國 US 1,0116,031 B2
專利權人 國立台北科技大學
發明人 李士修、黃鴻瑋
應用領域
需求項目









技術摘要


A vertical-transition structure comprises a microstrip line and a combination of a coaxial connector and a metallic ring underneath the microstrip line. A first through hole is created next to the microstrip line and near one end of its signal line. The metallic ring has a second through hole. The coaxial connector has a center conductor including an extended portion to be inserted into the second through hole via its center, and subsequently through the first through hole to connect to the signal line vertically. Specially, the extended portion is not inserted through the center of the first through hole. The present structure can improve the high-frequency insertion loss of the vertical transition caused by the sudden change of electromagnetic field distributions from a coaxial line to a microstrip line and the resonant response of the coaxial connector, and therefore, increase the 1-dB transmission passband of the vertical transition substantially.


專利商品特色




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聯絡人:專利技轉組
電 話:(02)2771-2171
地 址:10608 台北市忠孝東路三段1號 行政大樓5樓
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